Automatically extracts wafers from cassettes, inspects them, and uses camera positioning to locate carrier slots and wafer positions. High-precision correction robots place wafers into carrier slots. Specially designed for PECVD (Plasma-Enhanced Chemical Vapor Deposition) processes, this equipment achieves precise conversion of wafers from cassettes to carriers, ensuring efficient and stable PECVD coating operation. It is key automation equipment for the PV cell coating process.
HJT
Wafer Size: HJT: 182×91–210×105mm(Half-cut)
Throughput: HJT: 25000pcs/h (Half-cut)
Breakage Rate：≤0.1%(excl. incoming)
Uptime: ≥99%
