Automatically extracts wafers from cassettes, inspects them via inspection mechanisms, and uses camera positioning to locate carrier slot positions and wafer positions. High-precision correction robots then place wafers into carrier slots. Specially designed for PVD (Physical Vapor Deposition) processes, this equipment achieves precise conversion of wafers from cassettes to carriers, ensuring efficient and stable PVD coating operation. It is a key piece of automation equipment for the PV cell TCO coating process.
HJT
Wafer Size: HJT: 182×91–210×105mm(Half-cut)
Throughput: HJT: 25000pcs/h
Breakage Rate:≤0.05%(excl. incoming)
Uptime: ≥99%
© 2026 CHONTON. All Rights Reserved.
Designed by AdmarV