The chain loading machine receives AGV-delivered cassettes, conveys them to automated stations, and extracts wafers from cassettes row by row. After defect rejection via inspection modules, complete rows of wafers are precisely fed into the chain machine. The transfer machine sorts complete rows of wafers from the chain machine output into corresponding cassettes per process requirements, with robots transporting cassettes to tank equipment docking stations. The unloading machine transfers cassettes from tank docking stations to automated stations via robots; after visual inspection, cassettes are routed to AGVs, achieving fully automated closed-loop production.
BC、HJT、TOPCon
Wafer Size: BC: 182×91–210×105mm(Half-cut); HJT: 182×91–210×105mm(Half-cut); TOPCon:182–230mm (Full-cut)/ 182×91–210×105mm (Half-cut)
Throughput: BC: 28000 pcs/h (Half-cut); HJT: 28000pcs/h (Half-cut); TOPCon: 14000 pcs/h (Full-cut), 28000pcs/h (Half-cut)
Breakage Rate：≤0.2%(excl. incoming)
Uptime: ≥99%
