IGV carts transfer cassettes to the conveyor section, robots transport cassettes to the transfer mechanism and forward them to the pick-and-place station. Via gantry transfer or 6-axis robots equipped with precision suction cups and intelligent control systems, wafers are extracted from cassettes, loaded into quartz boats, and conveyed to process tools. After processing, wafers are unloaded from quartz boats into cassettes and transferred to the next process. Specially designed for ALD (Atomic Layer Deposition) processes, this equipment achieves precise conversion of wafers between quartz boats and cassettes, ensuring efficient and stable ALD operation.
BC、TOPCon
Wafer Size: BC: 182–230mm (Full-cut)/ 182×91–210×105mm(Half-cut); TOPCon:182–230mm (Full-cut)/ 182×91–210×105mm (Half-cut)
Throughput: BC: 16000 pcs/h (Full-cut)/ 20000 pcs/h (Half-cut); TOPCon: 16000 pcs/h (Full-cut), 20000pcs/h (Half-cut)
Breakage Rate：≤0.2%(excl. incoming)
Uptime: ≥99%
