The texturing loading machine completes wafer loading via stacked cassettes, automatically inserting wafers into cassettes, which are then transported by robotic arms to the tank equipment docking station for continuous and stable wafer feeding. The unloading machine transfers cassettes from the tank docking station to automated stations via robots; after passing visual inspection, cassettes are routed to the AGV system for automated unloading and transport. Specially designed for PV cell texturing processes, this equipment efficiently completes automated wafer loading/unloading operations, significantly improving production efficiency and process stability.
BC、HJT、TOPCon
Wafer Size: BC: 182×91–210×105mm(Half-cut); HJT: 182×91–210×105mm(Half-cut); TOPCon:182–230mm (Full-cut)/ 182×91–210×105mm (Half-cut)
Throughput: BC: 32000 pcs/h (Half-cut); HJT: 32000pcs/h (Half-cut); TOPCon: 16000 pcs/h (Full-cut), 32000pcs/h (Half-cut)
Breakage Rate：≤0.2%(excl. incoming)
Uptime: ≥99%
