IGV carts transfer cassettes to the cassette conveyor section, where robots transport cassettes to the transfer mechanism and forward them to the pick-and-place station. Via gantry transfer or 6-axis robots equipped with precision suction cups, intelligent control systems, and safety mechanisms, wafers are extracted from cassettes and loaded into quartz boats, then conveyed to the process tool. Conversely, after processing, wafers are unloaded from quartz boats into cassettes and transferred to the next process. This equipment is widely applicable to boron diffusion, oxidation, annealing, phosphorus diffusion, LP, and other high-temperature processes for automated wafer loading/unloading.
BC、HJT、TOPCon
Wafer Size: BC: 182–230mm(Full-cut) / 182×91–210×105mm(Half-cut); HJT: 182×91–210×105mm(Half-cut); TOPCon: 182–230mm(Full-cut) / 182×91–210×105mm(Half-cut)
Throughput: BC: 12000 pcs/h (Full-cut), 18000pcs/h (Half-cut); HJT: 18000pcs/h (Half-cut); TOPCon: 12000 pcs/h (Full-cut), 20000pcs/h (Half-cut)
Breakage Rate：≤0.2%(excl. incoming)
Uptime: ≥99%
